When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy manoeuvrability, the Die Brush easily rolls away excess paper to reveal the perfect cut!

The Sizzix Die Pick is perfect for picking small pieces of paper from intricate dies and die-cuts. It also has a comfortable handle grip for ease when working with a variety of materials.

Specification

• Die Brush: 5.5in x 1.75in x0.25in
• Foam Pad: 4.5in x 7.25in
• Die Pick: 5.375in x 0.5in x 0.5in

Contents

• 1 x Sizzix Die Brush & Foam Pad for Wafer Thin Dies
• 1 x Sizzix Accessory Die Pick